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Photo Release: Taiwanese and U.S. Industry Sign Letters of Intent
September 17, 2015








ARLINGTON, Virginia —  A Taiwanese delegation visited Washington, D.C., this week to meet with officials and U.S. grain industry leaders and take part in a signing ceremony at the U.S. Capitol, held Wednesday.

Signing letters of intent on behalf of the U.S. grain industry were Chip Councell, U.S. Grains Council vice chairman; Alan Tracy, U.S. Wheat Associates president; and Wade Cowan, American Soybean Association president representing the U.S. Soybean Export Council.

The letters committed Taiwanese buyers to purchase approximately $3.03 billion worth of U.S. corn and co-products, wheat and soybeans by 2017.

The delegation will follow their Washington visit with a week of touring the U.S. grain production region, including much of the U.S. Midwest and West.

More photos from the signing event are available at https://www.flickr.com/photos/usgc/albums/72157658602271702.

More about the event is at http://bit.ly/1KiEgmF and http://bit.ly/1WSXmcT.


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