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Photo Release: Taiwanese and U.S. Industry Sign Letters of Intent
September 17, 2015

ARLINGTON, Virginia —  A Taiwanese delegation visited Washington, D.C., this week to meet with officials and U.S. grain industry leaders and take part in a signing ceremony at the U.S. Capitol, held Wednesday.

Signing letters of intent on behalf of the U.S. grain industry were Chip Councell, U.S. Grains Council vice chairman; Alan Tracy, U.S. Wheat Associates president; and Wade Cowan, American Soybean Association president representing the U.S. Soybean Export Council.

The letters committed Taiwanese buyers to purchase approximately $3.03 billion worth of U.S. corn and co-products, wheat and soybeans by 2017.

The delegation will follow their Washington visit with a week of touring the U.S. grain production region, including much of the U.S. Midwest and West.

More photos from the signing event are available at

More about the event is at and

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